NEWS /
Samsung Develops Super Slim NAND Memory Packaging
07 Nov, 2009, 2:43 pm IST | by
Shayne Rana
|
|
Samsung Electronics Co., Ltd. has announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and mobile devices. "Thin remains the action word in today's mobile environment and we're taking a big step here at Samsung to make higher density memory less than half the thickness of what it was before," said Jim Elliott, vice president, memory marketing, Samsung Semiconductor, Inc. The new ultra thin package features a significantly thinner "bare" die that measures only half the thickness of a conventional die. The new 0.6mm-thick package, which consists of eight identical dies (called an octa-die package), uses 30-nanometer class, 32 gigabit (Gb) NAND flash chips, each measuring just 15um*, to deliver a 32 gigabyte (GB) NAND solution. The newly developed ultra-thinning technology overcomes the conventional technology limits of a chip's resistance to external pressure when under 30um in height. The productivity decline resulting from this thickness limitation had been directly attributable to a drop in production yields during mass production. The 15um-thickness represents a significant achievement as it can allow for double the density of previous multi-chip packages. The thinner die also dramatically reduces chip weight. In addition, the new package technology can be adapted to other existing MCPs, configured as system in packages (SiPs), or package on packages (PoPs). The breakthrough technique for 15um-and-under chip thicknesses will allow for the design of very high density solutions with the smallest of form factors - an extremely attractive prospect for the highly competitive mobile market. "We have achieved a major reduction in the thickness and weight of a large multi-die package to provide the best solution for combining higher density with multi-functionality in current mobile designs," said Tae-Gyeong Chung, vice president, test and package center, package development team, Samsung Electronics. "A package height under 1mm will provide set designers with much greater freedom in creating attractive designs that satisfy the diverse styles and thin-focused tastes of consumers today." |
Mixx
Facebook
Twitter
Digg
delicious
reddit
MySpace
StumbleUpon
LinkedIn
Samsung Galaxy Ace Duos GSM announced
Samsung Electronics Co., Ltd, has announced the new GSM variant of the Samsung Galaxy Ace Duos. Building ...
Samsung’s Galaxy Tab 2 310 shows up on Infibeam.com
Samsung officially launches Galaxy Tab 2 310 in India
Samsung Galaxy Tab 2 7.0 a.k.a 310 going for Rs. 20,000 online
Samsung announces the Omnia M
TVs, cameras, PCs to cost more as Rupee turns volatile
ICS rolling out on Samsung Galaxy Note
Leaked Images, Availability, Pricing,
Specs, Pre-order
Karbonn officially launches the A9 Android smartphone
14 May, 2012, 06:14 PM IST
Supreme Court website hacked in response to TPB, Vimeo block
17 May, 2012, 04:46 PM IST
Sony Xperia P up for pre-order on Infibeam, launching on 25 May
19 May, 2012, 04:32 PM IST
Samsung Galaxy S III pops up on eBay India for Rs. 44,770
22 May, 2012, 11:19 AM IST
16 May, 2012, 11:57 AM IST
The latest "should they-shouldn't they" event with Facebook is the lift of the minimu...
25 May, 2012, 12:33 PM IST
7.0
Today, we revisit the Dell XPS 15z in a slightly different configuration. The XPS 15z carries with it the same ...
Transcend StoreJet Cloud Drive (32GB)
ZOTAC GTX 670 Amp Edition Review
Top 5 potential Gmail alternatives
Google’s Gmail service is arguably the most advanced and feature-packed...
Five ways to beat the petrol hike
Petrol prices went up by a considerable amount post Wednesday, and this...
By Karan Shah
The Future of Broadband - views from industry leaders
One of the other events that took place at the same venue as the recent...
BlackBerry Curve 9320 announced in India for Rs.15,990
25 May, 2012, 06:23 PM IST
The BlackBerry Curve 9320 is one of the worst kept secrets from Research in Motion in recent times. The handset ...
Reliance Communications announces new 3G data plans
Samsung Galaxy Ace Duos GSM announced
Nokia PureLamda running WP 8.0 pops up on WP Bench app
YouTube launches a channel for Human Rights
Microsoft gains ground in patent feud with Motorola over texting
775 views
_011517074205_160x90.jpg "Epson Stylus Photo R3000")
BlackBerry Curve 9320 announced in India...
Samsung Galaxy Ace Duos GSM announced
Future iPhone, iPads may offer optical...
Google's official 7-inch tablet...
About Us | Site Profile | Tech2 Team | IBNLive News | IBNLive Hindi News | Cricket News | Indian Stock Market | Policy | T & C
Copyright © 2011, Tech2.com India - A Network 18 India Venture
